MSD Control Procedure.doc

1. PURPOSE目的：
Provide a handing Instruction for Moisture Sensitive Devices.
为温湿敏感元件提供正确的处理指引。
2. SCOPE 范围：
Compliant for management and controlling of Moisture Sensitive Device in Flexpower Shenzhen. 本程序适用于深圳伟创力电源的温湿敏感元件.
3. DEFINITION 定义：
MSDs Moisture Sensitive Device(Components whose package marked with picture1).
温湿敏感元件(外包装袋上标有中图1标识的元件)
MBB Moisture Barrier Bag 防潮袋
RH Relative Humidity 相对湿度
RIP Raw In Process 在制品物料暂存
HIC Humidity Indicator Card, A card on which a moisture sensitive chemical is printed such that it will change color from blue to pink when the indicated relative humidity is exceeded. 湿度指示卡：表面涂有湿度敏感化学原料，当湿度超过一定范围时卡会由蓝色变为粉红色。
Level/MSL 湿度敏感元件敏感等级.
Shelf Life The time that a dry-packed moisture-sensitive device may be stored in an unopened moisture barrier bag(MBB).It’s printed on the MBB. 保存期限 指温湿敏感元件在防潮袋中（开封前）的保存时间。保存期限通常列印在防潮袋包装上。
Floor Life The allowable time period, after removal from MBB and before the solder reflow process, for a MSDs to be exposed to a factory ambient. 暴露期限 MSDs 从包装袋取出到回流焊，允许暴露在生产环境下的期限。
4. REFERENCE DOCUMENT 参考文件：
IPC/JEDEC J-STD-033B Standard for handling, packing, shipping and use of moisture sensitive surface mount devices 湿度敏感的表面贴装器件的处理，包装，运输的标准。
5. RESPONSIBLITIES 职责：
5.1 PRD 生产部
5.1.1 Operators must clearly know the MSD list for each model.操作人员必须清楚地知道各个产品的防潮元件清单。
5.1.2 Operators must properly handle the MSDs package. 操作人员必须正确处理湿度敏感元件。
5.1.3 Stick and fill out ‘MSDs Tracking label ’on MBB. 在防潮袋上粘贴并填写‘湿敏元件跟踪标签’。
5.1.4 Monitor the storage and baking condition of the MSDs. 监控防潮元件的储存和烘烤情况。
5.1.5 Monitor the using status of the MSDs. 监控防潮元件的使用情况。
5.1.6 Inform ME relative staff to handle the special case. 若有突发事件请及时通知ME 相关人员。
5.2 PE工艺工程部
5.2.1 Determine the MSDs storage and baking condition base on component supplier’s guidelines(including component specification and anti-moisture label).根据元件供应商指引（包括元件说明河防潮标签）决定防潮元件的储存和烘烤条件。
5.2.2 Provide MSDs list for each model.提供各个产品的防潮元件清单
5.3 QA品质管理部
5.3.1IQC control Incoming material area temperature& RH, and check MSDs.
IQC 控制来料验货区的温湿度，并查验湿度敏感元件 。
5.3.2 IPQC supervise MSD handling. All FPS IPQC responsibilities will be replaced by operator. IPQC监督MSDs的处理情况.所有电源项目的IPQC工作将由生产部作业员代替。
6. PROCEDURE 程序：
6.1 IQC check the incoming material if it is MSDs.If it is not MSDs. then handling it as normal material; if it is MSDs, then check if the MBB is damaged and check if it exceed it’s shelf life.If either of over happened, then reject it to vendor. IQC检查来料是否为湿度敏感元件，如果不是，则按照普通物料处理；如果是湿度敏感元件，则检验其包装袋是否有受损和物料是否超出其保存期限。只要有上面两种情况之一发生，应将该物料退回供应商。
6.2 Warehouse send out the MSDs material to Production line according the principle of FIFO. 仓库人员根据先入先出的原则将湿度敏感元件发放给生产线。
6.3 Handing method MSDs on production Lines MSDs 物料在生产线上的处理方法
6.3.1 All relative operator shpuld know what is MSDs material, one way is that operator can know what is the MSDs according to ‘MSDs material list’, the other way is that operaors if it is packaged with vacuum bag on which there is MSDs sign, see picture1.
6.3.2 Operator in RIP shpuld stick ‘MSDs tracking label’(see attachment 1) on MBB before deliver MSDs to Production line. RIP仓的人员在将湿敏元件发到生产线前，要贴上‘MSDs追踪标签’（见附录1）。
6.3.4 Operator and record unsealing time in ‘MSDs tracking label ’(see attachment1) on the MBB when open the MBb, then inspect the HIC, see picture 2. If the color of HIC turns into pink reading at factory environmental conditions, the MSDs must be sent to back before it be used to mount. Baking condition see vendor’s spec or refer to table 4-1 and table 4-2 of JEDEC J-STD-033B(Note: MBB with ‘MSDs tracking label ’ should be kep until the MSDs is used up). 在拆封防潮带时，上料员在防潮包装袋上的‘MSDs追踪标签’（见附录1）上填写开封时间，然后检查湿度指示卡，如图2。如果在车间环境下发现HIC卡为粉红色，则此材料必须烘后才能使用。烘烤条件见供应商说明或JEDEC J-STD-033B的表4-1和表。（注意：粘有MSDs跟踪标签的防潮袋必须保存到湿度敏感元件用完为止。）
6.3.5 PRD must check ‘MSDs tracking lable’ of the MSDs every 4 hour ensure all the MSD are in their exposed time,IPQC should sample check MSDs status random as well. If the component exceeds exposure floor life .it should be baked in over before next round use.Floor life see vendor’s spec or refer to table 6-1. 生产部每四小时检查温湿敏感元件一次，确保所有的元件没有过期，IPQC也应作不定期的检查。如果生产线上的温湿敏感元件暴露在空气中超过规定的时间，必须烘烤才能使用。暴露期限见供应商的说明或参考表6-1。

Level
Floor Life（out of bag）at factory ambient≤30℃/60 %RH or as stated

Unlimited at ≤30℃/85 %RH

1 year

4 weeks

168 hours

72 hours

48 hours

24 hours

Mandatory bake before use. After bake must be reflowed within the limit specified on the label.
Table6-1 Moisture classification level and floor life/湿度等级及相应得暴露期限。
6.3.6 If production line using MSDs briefly till nor exceed it’s floor life, operator should put it into dry cabinet whose humidity is less than 20%RH. 如果生产线短时停止使用MSDs到不超过其暴露失效期，应将其放入相对湿度小于20%的防潮箱里。
6.3.7 All MSDs which are not used to up after being opened should be baked, If they aren’t used in long time ,we must vacuumize it in MBB with fresh and HIC again. PRD do it above. 凡是开封后未使用完的湿敏元件，一定要经过烘烤，如果长时间内不使用，还要用真空袋加干燥剂和HIC卡重新包装。以上由生产部完成。
6.3.8 Mark the ‘MSDs tracking label’(see attachment 1)affixed on MBB once the resealed bags are opened again. 一旦已经烘烤的防潮包装材料再次开封，同样要填写‘湿度敏感元件跟踪标签’（见附录1）.
6.4 Sort MSDs from other dropout components, then bake them according various baking conditions. 将防潮元件从其它掉落的物料中分类出来，然后全部烘烤后再利用。
6.5 Baking conditions 烘烤条件
If vendor supply the spec for baking on MBB, then follow the spec to bake the MSDs which to be baked. Otherwise refer to the table 4-2 in ‘IPC/JEDECJ-STD-033B’ 如果在防潮包装上供应商提供烘烤说明，则按照说明烘烤需要烘烤的湿度敏感元件；否则参考表‘IPC/JEDECJ-STD-033B’中的表4-1和4-2的要求进行烘烤
6.6 floor life darating due to various factory environmental conditions 由于不同的车间环境因素暴露期限将会改变
Table 7-1 in ‘IPC/JEDEC J-STD-033B’list equivalent darated floor lives for humidity’s ranging from 5% to 90% RH for three temperature: 20℃,25℃,30℃.This table is applicable to MSDs molded with novolac, biphenyl or multifunction epoxy mold compounds. IPC/JEDEC J-STD-033B中的表7-1 列出三种不同温度下湿度范围从5%到90%的情况下的MSDs暴露期限的参考等效期，该表适合于SMDs是由树脂， 苯或多功能效环氧聚合物。
7 RECODE纪录：
FDMEI-016F01.1‘Moisture Sensitive Devices List’keep at DCC for at least two years
防潮元件清单 保存于文件中心至少两年

8. FLOW CHART流程图：IQC检查湿敏元件包装袋是否破裂或过期
如果有问题，退回厂商处理
物料暂存仓粘贴湿敏元件追踪标签生产部填写开封时间
HIC卡变紫红色
烘烤并加干燥剂真空包装
检查湿敏元件暴露时间
超过期限？
继续使用
烘烤超过1次？
烘烤并加干燥剂真空包装
YES
NO
YES
NO
YES
能否使用征询供应商意见

9. ATTACHMENT 附件：
9.1 Attachment1：MSDs Tracking Label 附件1：温湿敏元件跟踪标签
湿度敏感元件跟踪标签

元件料号

确认
可暴露时间

操作者
IPQC
第一次使用
拆封时间

使用截至时间

烘烤时间/条件

重包装时间

第二次使用
开封时间

使用截至时间

Note/填写说明：
A） 可暴露时间：fill MSDs floor time supplied by vendor 填写供应商提供的可暴露时间
B） 拆封时间： fill time when the MSDs’bag was opened 填写打开真空防潮袋的时间
C） 使用截止时间：fill time when stop using the MSDs 填写防潮元件停止使用时间
D） 重新包装时间：fill time when MSDs are repackaged 填写对防潮元件重新真空包装的时间。
9.2 Attachment 2 FDMEI-016F01.1 Moisture Sensitive Device List
附件2： FDMEI-016F01.1 防潮元件清单