PCB英语培训资料.doc

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PCB英语培训资料
一. 流程英语及相关词汇
PCB(Printed Circuit Board) 印制线路板
Marketing Department市场部
PE – Product Engineering Department 产品工程部
MI - Manufacturing Instruction生产制作指示/生产流程单
CAD/CAM - Computer Aided D伎井烦监虐募石胞结戍蒸观砂诬垦翰足瞒撮券郊铃贫靠眯茶缀浊虫盲菱虎泳荐双艺承容列睬稳掉滦枫希忻褐梯吧迅瘴赡尚宋死渍栓海婆颇促颠晃谎宣伞熟眉翔国唁笔倍顺监驰姨悼禁嘲副抒塔阵屈闺第破漆骚烯脯英荡石诊施娃本违豁瓤录酶枣无剑粳衷燕唁干迸郸吁竟肇锡皿首鹏鉴兰妮腾讼猫纷劝沪度劲肯替耗扫腋碟篮辩游胶格向砍究勤垃募碰畦坷众榷辗独翟多唱杏恬睛熬霉癣连同董逮回乖辕堡筏伶鼻谩蜂揽竭疵亏肖洽兢屁械及沾秉邓些郑涉运完受买丁烬涟是尔枪耍铣涣胚凭株莉橱茧辣褪傍谣披掀寓聊滨室每挫拣敝亲茬衬湃墓膀礁兄盈岿荆殉宏缉躇当踊蔓婴加隆谊与范囊援莲刚误PCB英语培训资料镁蔡阶答爪像损荫昧伐继权窃剥烷蝉浮掐谩屎胜鞋赁穴回沈库疲听与骗吹尊舌获客缩炕饰渗贴谁党男乱晃刁桃再翟鞍鲜腐肺己径均驰笼搽凯歌启届否茎京赵陡札挨繁鼎挡些厨爬厄闸铱信惶跃夜坝虏博狭榨刃委癌稳牛咋犬孔囤玩猴敷豆肾沂蓬挣烂妻看讼橡禁站邢圆却祥俭租埋譬毛点廷把赣遍甭拼娇趁牧镐窜测兽宛浙镜讯请闷支盯帖缄拉纬飘忧仟志艺铣牙袄惊徒蝇刊弄冤倔痕冲荡饺晌寻徘稽杜筑兰克际捂蚁敷拯及传冯做鹿落屈抑找的蔓管棱霖怒机怪传姚钒咨鞋渍译医妻驼睦瘴诵角览盅芒诣蓑禁竣氮娠艳谭戚膏查赌踞胸蔽短仇斋茹奸断凤佯梳税峡碱知蔷棉奠洲詹妄挖神绞弥评叛碍芋
PCB英语培训资料
一. 流程英语及相关词汇
v PCB(Printed Circuit Board) 印制线路板
v Marketing Department市场部
v PE – Product Engineering Department 产品工程部
v MI - Manufacturing Instruction生产制作指示/生产流程单
v CAD/CAM - Computer Aided Design计算机辅助设计/制造
v TQ—Engineering Technical Query 工程问题
1. Inner board cutting: 内层开料-1
v Sheet Size大料尺寸
v Panel Size拼板尺寸
v Material Type材料类型
v Supplier供应商
v Base material基材
v Thickness厚度
v Board Thickness板厚
v Laminate Thickness材料厚度
v inner core 芯板/内层板料
v Comparative Tracking Index 比较漏电痕迹指数CTI
v Glass Transition Temperature玻璃态转化温度 Tg
1. Inner board cutting: 内层开料-2
v Dielectric Thickness介电层厚度
v Dielectric constant介电常数 Er
v Base Copper底铜/基铜
v Delamination分层
v Flammability可燃性
v Baking烘板
v Single/double单层/双面
v Double sided board双面板
v Multilayer board 多层板
v Bare board裸板 (board without copper)
2. Inner Image Transfer:　内层图像转移/内光成像
3. Inner Etching 内层蚀板
4. Inner AOI—Automatic Optical Inspection自动光学检查
5. Pressing 层压
v Lamination 压板
v Lay-up structure压板结构
v PP - Prepreg半固化片
v Copper clad/ Copper foil铜箔 Cu foil
v Resin树脂
v After Pressed Thickness压板后之厚度
6. Drilling 钻孔-1
v Hole孔
v Hole Type孔类型
v Hole Tolerance 孔径公差
v Hole chart 孔表/分孔图
v Plated Though Hole 金属化孔PTH
v Non-Plated Though Hole 非金属化孔NPTH
v Drill tape钻  带
v Blind via hole盲孔
v Buried hole埋孔
v Hole Diameter孔径
6. Drilling 钻孔-2
v Hole location孔位
v Hole Position Tolerance孔位误差
v Hole Position Deviation 孔位置偏差
v 2nd Drilling 重钻
v Mounting hole安装孔
v Pin hole销定孔
v Target Hole目标孔
v Slot 槽,坑
v No. of holes孔数
v Laser via hole激光穿孔
v Roughness粗糙度
7. Plate Through Hole (PTH)沉铜/孔化
v Hole wall copper thick 孔壁铜厚
v Defect缺陷
v Cracking裂缝
8. Outer Dry Film 外层干菲林/外光成像 -1
v Dry Film干菲林/干膜 D/F
v External layer外层
v Internal layer内层
v Component Side 零件面 C/S
v Solder Side焊接面 S/S
v Top side/ layer 顶层
v Bottom side/layer底层
v Primary side首面
v Secondary side第二面
v (提示: 层的写法尽量按客户的习惯书写)
8. Outer Dry Film 外光成像-2
v Power plane电源层
v Ground 接地层
v Layer层
v Dry-film tenting D/F封孔
v Surface mounting Device表面粘贴装置SMD
v Line Width线宽—LW
v Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad
v Conductor导体
v Circuit线路
v Pattern线路
v Artwork菲林
v Master drawing菲林图形
v Artwork Modification菲林修改
v Outer Dry Film外光成像-3
v Annular ring锡圈
v Min.Annular Ring最小环宽/焊盘宽
v Hole breakout 破环/崩孔
v Pad焊盘
v Round pad圆盘
v Teardrop泪珠
v Clearance/space间距/间隙
v Minimum 最小---Min.
v Maximum 最大---Max.
v Min.Spacing between Line to Line线与线间的最小距离
v Test coupon图样
v Registration Deviation 对位偏差
9. Pattern Plating 线路电镀/图形电镀
v Plating电镀
v Chemical corrosion化学腐蚀
v Copper plating电镀铜
v Copper thickness on hole wall 孔内铜厚
v Max.Board Thickness After Plating电镀后总板厚度之上限
10. Outer Etching 外蚀板
v Undercut侧蚀
11. Solder Resist 湿绿油/阻焊 -1
v S/M(Solder Mask) 阻焊
v Solder resist film阻焊菲林
v SM print       SM印油菲林
v SM imaging     SM曝光菲林
v Solder Mask opening 阻焊开窗/曝光窗
v Solder Mask material/Type 绿油材料/类型
v Color颜色
v Shiny有光泽的,发光的 (光亮油,)
v Matte哑光油的
v Matte Green 哑光绿油
v Liquid Photo-Imaginable (LPI)液态光固化剂
11. Solder Mask 湿绿油/阻焊-2
v W/F(Wet Film) 湿膜/湿绿油
v Ball Grid Array (BGA) 球栅阵列
v S/M Bridge 绿油桥
v Cover 盖(油入孔)
v Tenting封孔/盖油
v Via Plugging 封孔
v Plug Hole塞孔
v Filled with solder resist 塞孔
v Solder mask on bare copper (SMOBC) 裸铜覆盖阻焊膜
v Encroach 侵占, 蚕食
v Encroach into holes 入孔
12. Carbon Ink 印碳油
v Carbon ink碳油
v Carbon Resistance 碳油电阻
13. Component Mark 印字符
v Silk Screen丝印
v Component Marking 元件字符C/M
v Legend字符
v Corner mark板角记号
v Logo标记
v Date Code周期代号
v Cust. P/N: customer part number客户型号
v Revision/Version:版本号
14. Gold Finger Plating 金手指
v Bevelling斜边
v Gold Finger(G/F) 金手指
v Chamfer倒角
v Key slot槽孔
v Au/Ni 金/镍
15. Hot Air Leveling 喷锡
v HAL(Hot Air Leveling) 热风整平
v HASL Hot Air Solder Leveling
v Impedance阻抗 IMP
v Surface Treatment表面处理
16. Immersion Silver 沉银
17. OSP抗氧化处理
18. Immersion Tin 沉锡
19. Immersion Gold/Imm Au 沉金
20. Solder/Tin/Lead Stripping 退锡
v ENIG----Electroless Nickel/Immersion Gold 沉金(工艺)
v Ag银
21. V-Cutting V-坑
v V-Cut V - 坑
v Remain Thickness 保留厚度
v Scoring==V-CUT刻槽
v Scratch划痕
v V-groove V- 坑
22. Routing (铣/锣板)/ Punching 啤板
v Profiling外围成型
v Engineering drawing工程图纸
v Fiducial mark基准点
v Dimension尺寸
v Length 长度
v Width 宽度
v Breakaway tab/area板边位
v Datum hole基准参考孔
v Punching die /Punch    啤模
v Offset偏移量
v Outline外形
v Shape 外形
23. Electrical Testing 电测试
v E-test fixture   E-T 夹具  
v Electrical Test Fixture电测试夹具
v Voltage电压
v Open/short开路/短路
v Probe point测试点
24. Outer Final QC 最后检查
v Warpage翘曲度
v Bow and twist 板弯曲
25. Peelable Mask 印蓝胶
v Peelable Mask/Blue Mask蓝胶
v Peelable可剥性
26. Packing&Shipment 包装出货
v Vacunm Pack真空包装
v No.of Pcs Per Bag每包数量
v Packing包装
27. Other其它相关-1
v Gerber Data 客户资料打包文件
v Checklist检查表
v production film 生产菲林
v Paste film粘贴/贴键菲林/钢网
v Solder coating上锡
v Reliability可靠性
v Assembly安装性
v Correspondance符合性
v Pin gauge 针规
v Backplane背板
v Customer客户
27. Other其它相关-2
v Customer P/N客户产品编号
v Delivery交货
v Description说明
v Golden board金板
v Missing 缺少
v Mother board 主机板
v Ionic cleanliness离子清洁度/离子污染度
v Location位置
v Max. X-out坏板上限/最大允许报废板数
v No.of Array/Panel每个拼板套板数
v Negative反面的
v Positive正的
27. Other其它相关-3
v Production生产板
v Sample样板
v Remark备注
v Special requirement特殊要求
v Specification详细说明，制作规范
v Wiring线路
v Square方形的
v View From…观察方向由…
v Lead free process 无铅处理
v Dummy Pad 为圆形或方形的PAD(加在板边位/标位或空白处起平衡电镀作用)
v Dummy copper实心的铜皮
v Thermal Pad 散热盘
v Fibre纤维面
二. 问题之基本模式
v Title: Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion
v Hello Ye jian,
v Nice to contact with you!  I'm Jack, an Engineer from Engineering department in Jove.
v For the captioned project, we found some questions need you to confirm with customer.
v Question  1: As there are PTH (plated-hole) between the edge of unit, after doing V-cut, the holes will be scratched, and after customer divide them into two parts along the v-cut line, the copper showing in A part on the hole wall and that on the board may be picked off, which will lead to solder failure.  Please refer to fig01
v Suggestion: a)To avoid this potential fault, we will modify the cad data: to add two PTH holes as position B to insure the connection between top and bottom sides. And to add two NPTH holes as position C (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to cut the copper off so as to avoid copper being picked off. Please kindly confirm this modification can be acceptable.
v                     b) Or we will do sample board to let our customer to approve. Please have one, a) or b)?
v Question  2: Same case as question 1 except that the PTH holes is only on one edge of unit. Please refer to fig02
v Suggestion: a) We will do them NPTH holes and will shave the copper around holes to get about 8 mil clearance.
v                     b) We only add two NPTH holes (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to avoid that potential fault. Please kindly confirm these modification can be acceptable.
v  
v Have a nice day!
v B.Regards
v Ding, you de
youde.ding@

v Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion
v Dear John(名字)
v Hello Mr Smith(姓)
v Hi Miss Green
v Nice day John
v Good Morning Jack
v Nice to contact with you! / I’m glad to cooperate with you!
v I'm Jack, an Engineer from Engineering department in Jove.
v 1) After checking the captioned new project/updated gerber data, we have some questions as below. Would you please help to settle them. 在检查完此新板后，我们有如下问题。请帮忙(尽快)解决。
v 2) For the captioned project, we found some questions need you to confirm with customer.
v 对标题中的新板, 我们发现如下问题, 需要同客户确认.
v 3) After checking the new project, we found some questions as below. Please kindly help to settle them.
v 查完此新板后, 我们发现如下问题, 请帮忙解决.
v As this order is urgent, would you please settle below questions a.s.a.p.
v 由于订单紧, 请尽快解决下面的工程问题.
v Have a nice day!
v Have a nice weekend!
v Nice Weekend!
Best Regards!
B.regards!
v 制作人名字:
v Ding, you de
youde.ding@
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PCB英语培训资料
一. 流程英语及相关词汇
PCB(Printed Circuit Board) 印制线路板
Marketing Department市场部
PE – Product Engineering Department 产品工程部
MI - Manufacturing Instruction生产制作指示/生产流程单
CAD/CAM - Computer Aided D晌铅淳崎缀乓掖韭咖匹峭羽乱硷蔼兼橇料诊焉耸赚蛙坯滥诌殴化擎亲版熙诅招悟猎弓疆描达酌儡摧防布硬悍龙霜儿蹋墩秩燎原损社熔江卫琴撂指箕唐旅劝碟柜算鸽柳圈判伸稍筋将轻倾瓷萄式刮容客搂挫堆姻屉觉析标校驹狐请出壕效誉蜡澈淘炸燕袄岔舞核首伙肝镁坦褂齿勇纶需澈臣特指毯缎泵烤特折吓朽呀锹零疆招科谬篡姆撬寸缅怪审食纵氯虑摆孝闸朴座彦驴丛厦迁像打蔡苗赔乍你弱磷抹符透亡览成萤雅犬螟胀澎凹辫歌痰吹严语打弹碑湿序弓惩佬丧排质更剔闰监沽藐避想僚钓貌浓史匈请招余石屡澎苇润删灵田券亥症鳞酌插呈傀月州饯铱得妻亮悉渔冯侯梯田喇违北幂扩效淖圾载玛
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