芯片封装.pptx

,Http:/www.HTKSMT.com,Why assembly of dice,？为什么要封装芯片,ELECTRICAL,INTERCONNECTION,电连接,MECHANICAL SUPPORT/HANDLING/SOLDERING,提供机械支持，便于处理及电焊,PHYSICAL/CHEMICAL/RADIATION PROTECTION,防止物理,/,化学,/,辐射物损伤,POWER DISSIPATION,散热,How to assemble the dice?,如何封装芯片,BGA PROCESS FLOW BGA,生产流程,Wafer Mount,Wafer Saw,Die Attach,Wire Bond,Molding,Marking,Solder balls Placement,Singulation,Testing,Packing,Wafer Mounting,贴片,Operation:To stick wafer on adhesive tape,操作：将来料晶片粘贴在蓝膜上,Aim:To sustain and hold the wafer during Sawing and Die Attach,目的：在切片及粘片的工序中保持晶片和芯片稳固的位置,Wafer Sawing,切片,Operation:Sawing of the wafer through the scribing streets,操作：沿切割道切割芯片,Aim:To separate the dice,目的：将晶片切割为芯片单元,Die Attach,粘片,Operation:To attach the die to the PCB,操作：将芯片粘贴于印刷电路板上,Aim:To fix the die for wire bonding,for electrical connection and thermal dissipation,目的：为了焊线工序固定芯片位置，同时实现导电和导热,Wire Bond,焊线,Operation:Bonding wires on the die and bonding fingers,操作：在芯片焊区与印刷电路板焊区之间焊线,Aim:To connect the bonding pads of the die to the bonding fingers of the substrate,to electrically link the die to external circuit,目的：连接芯片焊点和印刷电路板焊点，进而可以通过锡球连接外部电路,Molding,模封,Operation:To encapsulate the substrate and the bonded die in a mold compound,操作：将部分,PCB,和焊线后的芯片封装于模封料内,Aim:To protect the die and the bonding wires from external physical/chemical damage.,目的：防止芯片和引线受到外部物理,/,化学的损伤,Marking,打印,Operation:To laser engrave the mold compound,操作：在模封表面进行激光打印,Aim:To mark with salestype,and traceability code,目的：确保打印正确的销售类型，和追溯代码,Solder Balls Placement,焊锡球,Operation:To place solder balls on the solder ball pads.,操作：在放锡球区焊上锡球,Aim:To make electrical connection interface between internal circuit and external PCB.,目的：建立一个连接内部电路与外部电路板的连接点,Operation:To singulate each unit,操作：将包含多个元件的,PCB,切割成单个元件,Aim:To deliver products that can be mounted and soldered on PCB.,目的：提供可供安装焊接在电路板上的单个元件,Singulation,切割,Operation:To test and classify devices.,操作：将元件测试分类,Aim:To ensure electrical function of devices,correct sales type.,目的：确保元件电性能和正确的销售类型。,Testing,测试,Accept,Reject,Operation:To pack the devices into the reel and the reel into inner box.,操作：将元件装入包装带后装入包装盒内,Aim:To provide physical and ESD protection during handling and transportation,目的：在处理和搬运过程中防止物理或静电损伤,Packing,包装,