LXES15AAA1-153 esd静电保护二极管-tvs二极管 村田_骊微电子.PDF
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1、Ceramic ESD Protection Device LXES*A series Document No.LX1-1111 Rev1.2p1/18 1.This specification shall be applied to the ESD Protection Device.LXES15AAA1-133 LXES03AAA1-134 LXES15AAA1-153 LXES03AAA1-154 2.Part Number ConfigurationLXES 15 A AA 1 133 Product ID(LXES=ESD Protection device)Dimension Co
2、deUnit:mm Code Dimension 03 0.6 x 0.3 15 1.0 x 0.5 Type(A:Ceramic ESD)Control CodeNumber of channelSerial NumberRoHS CompliantHalogen freeT/R only.MSL 1深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p2/18 3.CONSTRUCTION,DIMENSIONS3-1 DIMENSIONSUnit:mm Size L W T a b 0603 0.600.03 0.300.03 0.33 max 0.150.05 0.20
3、min 1005 1.000.05 0.500.05 0.33 max 0.200.10 0.40 min 3-2 Circuit Diagram TERMINAL CONFIGURATION This device is bi-directional.3-3 Product Weight P/N Weight mg LXES03AAA1-154 LXES03AAA1-134 0.2 LXES15AAA1-133 LXES15AAA1-153 0.5 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p3/18 4.CHARACTERISTICS4-1-1 Ratings(L
4、XES15AAA1-133)Parameter Symbol Ratings Units Rated Voltage VDC15 V VAC 040 V Operating Temperature TOP-40 to+85oC Storage Temperature TSTO-40 to+85oC Frequency:1MHz4-1-2 Ratings(LXES03AAA1-134)Parameter Symbol Ratings Units Rated Voltage VDC6.3 V VAC 040 V Operating Temperature TOP-40 to+85oC Storag
5、e Temperature TSTO-40 to+85oC Frequency:1MHz4-1-3 Ratings(LXES15AAA1-153/LXES03AAA1-154)Parameter Symbol Ratings Units Rated Voltage VDC 4 V VAC 025 V Operating Temperature TOP-40 to+85oC Storage Temperature TSTO-40 to+85oC Frequency:1MHz4-2 Electrical Characteristics(T=25 deg.C)Chip size mm Part No
6、.Capacitance ESD IEC 61000-4-2(Air)ESD IEC 61000-4-2(Contact)Symbol C-Unit pF kV kV Test condition 1MHz Vbias=0V 0603 LXES03AAA1-154 0.05 typ 15 15 LXES03AAA1-134 0.035typ 15 15 1005 LXES15AAA1-133 0.05 typ 15 15 LXES15AAA1-153 0.05 typ 15 15 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p4/18 4-3 Typical Chara
7、cteristic LXES03AAA1-134 ESD Waveform(IEC61000-4-2:8kV Contact)Voltage Capacitance Characteristic LXES03AAA1-154 ESD Waveform(IEC61000-4-2:8kV Contact)Voltage Capacitance Characteristic LXES15AAA1-133 ESD Waveform(IEC61000-4-2:8kV Contact)Voltage Capacitance Characteristic 0 50 100 150 200 250-10.0
8、0.0 10.0 20.0 30.0 40.050.0 Voltage VTine nsec0 50 100 150 200 250 300 350 400-10 0 10 20 30 40 50 Voltage VTime nsec深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p5/18 LXES15AAA1-153 ESD Waveform(IEC61000-4-2:8kV Contact)Voltage Capacitance Characteristic 0 50 100 150 200 250 300-10 0 10 20 30 40 50 Voltage VT
9、ime nsec深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p6/18 5.Reliability TestNo.Items Specifications Test Methods Number Result (Fail)1 Vibration Resistance No severe damages Satisfy dimension specifications Solder specimens on the testing jig(glass fluorine boards)shown in appended Fig.1 by a Pb free solder.T
10、he soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock.Frequency :102000 Hz Acceleration:196 m/s2 Direction :X,Y,Z 3 axis Period :2 h on each directionTotal 6 h.22 G(0)2 Shock Solder specimens on the te
11、sting jig(glass fluorine boards)shown in appended Fig.1 by a Pb free solder.The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock Acceleration :14,700 m/s2 Period :0.3 ms.Cycle :3 times 22 G(0)3 Defle
12、ction Solder specimens on the testing jig(glass epoxy boards)shown in appended Fig.2 by a Pb free solder.The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock.No damage with 1.6mm deflection 22 G(0)4
13、Soldering strength(Push Strength)LXES03A series 2N Minimum LXES15A series 3N MinimumSolder specimens onto test jig shown below.Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken.Pushing force is applied to longitudinal direction.22 G(0)5 Solderability of Termin
14、ation 95%of the terminations is to be soldered evenly and continuously.Immerse specimens first an ethanol solution of rosin,then in a Pb free solder solution for 30.5 sec.at 2455 C.Preheat :100-120 C,60 sec.Solder Paste:Sn-3.0Ag-0.5Cu Flux:Solution of ethanol and rosin(25%rosin in weight proportion)
15、22 G(0)6 Resistance to Soldering Heat(Reflow)Appearance Electrical specifications No severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Preheat Temperature :150-200 C Preheat Period :120+/-60 s High Temperature :217 High Temp.Period :105+/-45 s Peak Temp
16、erature :260+0/-5 C Specimens are soldered twice with the above condition,and then kept in room condition for 24 h before measurements.22 G(0)Pushing Direction Jig Specimen 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p7/18 No.Items Specifications Test Methods Number Result(Fail)7 High Temp.Exposure Appearance
17、Electrical SpecificationsNo severe damages Satisfy specifications listed in paragraph 4-2 over operational temperature range Temperature:85+2/-0 C Period :1000+48/-0 h Room Condition:2 24 h 22 G(0)8 Temperature Cycle Set the specimens to the supporting jig in the same manner and under the same condi
18、tions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the following table.Set it for 2 to 24 h at room temperature,then measure.Step Temp(C)Time(min)1 Min.Operating Temp.+0/-3 303 2 Max.Operating Temp.+3/-0 303 22 G(0)9 Humidity(Steady State)Temperature:852 Humidi
19、ty:8090%RH Period:1000+48/-0 h Room Condition:2 24 h 22 G(0)10 Low Temp.Exposure Temperature:-402 Period:1000+48/-0 h Room Condition:2 24 h 22 G(0)Fig.1 Reference Land Pattern Unit:mm Size a b c 0603 0.25 0.8 0.3 1005 0.4 1.2 0.5 Notes:this land layout is for reference purpose only.深圳市骊微电子科技有限公司半导体专
20、业供应商深圳市骊微电子科技有限公司p8/18 Fig.2 Testing board Mounted situationTest methodLandLand pattern is same as figure1 Glass-fluorine board t1.6mm Copper thickness over 35 mm(Unit:mm)(Unit:mm)(Unit:mm)45 45 CHIP R2305020deflection 深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p9/18 6.Tape and Reel Packing(1)LXES03A1)Dimens
21、ions of TapeUnit:mm Symbol L W T a b c d e f Size(0.67)(0.37)0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 1.55+/-0.05(2)LXES15A series2)Dimensions of ReelUnit:mm Symbol L W T a b c d e f Size(1.12)(0.62)0.5 max 2.00+/-0.05 4.00+/-0.10 3.50+/-0.05 1.75+/-0.1 8.00+/-0.30 1.55+/-0
22、.05 edcbafFeeding direction深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p10/18(3)Dimensions of ReelUnit:mm(4)PackagingP/N pcs/reel LXES03AAA1-154 LXES03AAA1-134 15,000 LXES15AAA1-133 LXES15AAA1-153 10,000 Symbol a b c d e Size 2.0+/-0.5 13.0+/-0.2 9.0+1.0/-0 60+1.0/-0 180+0/-1.5 d e c b a 深圳市骊微电子科技有限公司半导体专业供应商
23、深圳市骊微电子科技有限公司p11/18(5)Taping Diagrams1)LXES03A series1 Feeding Hole:As specified in(1)(2)2 Hole for chip:As specified in(1)(2)3 Cover tape :50 m m in thickness4 Base tape:As specified in(1)(2)Chip Feeding Direction Feeding Hole 1 2 3 3 4深圳市骊微电子科技有限公司半导体专业供应商深圳市骊微电子科技有限公司p12/18 2)LXES15A series1 Feed
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