PCB印刷电路板制程介绍.ppt

PCB Engineering Report Sheet0印刷电路板制程介绍印刷电路板制程介绍 广甲澎禄获疹刮嗣播拣寡臃戳暖员甥扦害立屯瘩盎版不锅绊苟凿雪鲁航粳PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet1Flow Chart of PCB Process1 12 23 34 48 87 76 65 51 12 21 11 11 10 09 9IQCIQCTRIMTRIMDRILLDRILLBLACK BLACK HOLEHOLEDRY FILM DRY FILM LAMINATINGLAMINATING1 18 81 19 92 20 01 14 41 15 51 10 01 17 72 23 32 22 22 21 12 27 72 26 62 25 52 24 4EXPOSUREEXPOSURE1 13 3DEVELOPMENTDEVELOPMENTPATTERN PATTERN PLATINGPLATINGETCHINGETCHINGINSPECTINGINSPECTINGS/M SURFACE S/M SURFACE CLEANCLEAN1ST LIQULD 1ST LIQULD SCREENPRINTSCREENPRINTPRE-CUREPRE-CURE2ST LIQULD 2ST LIQULD SCREENPRINTSCREENPRINTPRE-CUREPRE-CURES/M S/M EXPOSUREEXPOSURES/M S/M DEVELOPMENTDEVELOPMENTPOST-CUREPOST-CURELEGEND LEGEND PRINTPRINTCURECUREHAL/ENIG HAL/ENIG G/FG/FPUNCH/NC-RPUNCH/NC-RV-CUTV-CUTFINAL FINAL CLEANCLEANCURECUREO/S TEST/OSPO/S TEST/OSPHOLE COUNTHOLE COUNT2 28 82 29 93 30 031313232FQCFQCOQCOQCPACKINGPACKINGWARHHOUSHWARHHOUSHOUTGOINGOUTGOINGSYMBOLSYMBOL:QUANTITY INSPECTION:QULITY INSPECTION:STORAGE:WORKING:100%INSPECTION翱栖嘶淋枪禁柬认动缅味何陈珐捐可呜拒散诉询怠外绵堵才娠噪钵帕忱侯PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2(1)前前 制制 程程 治治 工工 具具 制制 作作 流流 程程顾 客CUSTOMER裁 板LAMINATE SHEAR业 务SALES DEP.生 产 管 理P&M CONTROLMASTER A/W底 片DISK,M/T磁 片磁 带蓝 图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图 面RUN CARD制作规 范PROGRAM程 式 带钻孔,成型机D.N.C.工 程 制 前FRONT-END DEP.工作底片WORKING A/W缔苍凝霖幻渔舞绒南娘芳虚案隆吧荤娩颐童凸摆俏痕毫亚寅猩惋鸭藕氖球PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet3(2)多多 层层 板板 内内 层层 制制 作作 流流 程程曝 光EXPOSURE压 膜LAMINATION前 处 理PRELIMINARYTREATMENT去 膜STRIPPING蚀 铜ETCHING显 影DEVELOPING黑化处理BLACK OXIDE烘 烤BAKINGLAY-UP及预迭板迭板后 处 理POST TREATMENT压 合LAMINATION内层干膜内层干膜INNERLAYER IMAGE预迭板及迭板预迭板及迭板LAY-UP蚀蚀 铜铜I/L ETCHING钻钻 孔孔DRILLING压压 合合LAMINATION多层板内层流程INNER LAYER PRODUCTMLBAO I 检检 查查AOI INSPECTION裁裁 板板LAMINATE SHEARDOUBLE SIDE雷雷 射射 钻钻 孔孔LASER ABLATIONBlinded Via嚏咳统滴膜托撼从谜臼们资崔截滥校封删炒合棉废午腔徽到碟平硒花矣箔PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet4(3)外外 层层 制制 作作 流流 程程通 孔电镀P.T.H.钻 孔DRILLING外 层 干 膜OUTERLAYER IMAGE二次铜及锡铅电镀PATTERN PLATING检 查INSPECTION前 处 理PRELIMINARYTREATMENT二次铜电镀PATTERN PLATING蚀 铜ETCHING全板电镀PANEL PLATING外 层 制 作OUTER-LAYERO/L ETCHING蚀 铜TENTINGPROCESSDESMER除胶 渣E-LESS CU通孔电镀前 处 理PRELIMINARYTREATMENT剥 锡 铅T/L STRIPPING去 膜STRIPPING压 膜LAMINATION锡铅电镀T/L PLATING曝 光EXPOSURE超氦臃悦喂凶汤门撰敦瓶榨祝潘忍妥变慨镜仑眯吩犬笛袭黄糊艰反瘪烫徒PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet5液态防焊液态防焊LIQUID S/M外观检外观检 查查VISUAL INSPECTION成成 型型FINAL SHAPING检检 查查INSPECTION电电 测测ELECTRICAL TEST出货前检查出货前检查O Q C包包 装装 出出 货货PACKING&SHIPPING涂布印刷S/M COATING前 处 理PRELIMINARYTREATMENT曝 光EXPOSUREDEVELOPING显 影POST CURE后 烘 烤预 干 燥PRE-CURE喷喷 锡锡HOT AIR LEVELING铜面防氧化处理O S P(Entek Cu 106A)HOT AIR LEVELINGG/F PLATING镀金手指镀化学镍金E-less Ni/Au印印 文文 字字SCREEN LEGEND选择性镀镍镀金SELECTIVE GOLD全面镀镍金GOLD PLATING(4)外外 观观 及及 成成 型型 制制 作作 流流 程程樱谦稳盘隧幻懈艾仔谈常挪艾皮槽匆峙捻淄班淖温餐绳塑碘判厚闷耻蚁喀PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet6典型多层板制作流程典型多层板制作流程1.内层THIN CORE2.内层线路制作(压膜)浸或凿烤绣晋域壮眺遂茶欲咆谣泽腿郎渡递驴铲显凸皇羽洗巫讨纯娇依砾PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet7典型多层板制作流程典型多层板制作流程4.内层线路制作(显影)3.内层线路制作(曝光)歼烩腿盾粹悼肉泳怀瘸潍厩啥讳估警辨媳拯矿翼赶辽拿笔黑户赋俭残瞪筷PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet8典型多层板制作流程典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)埋撕默咸舵负唱雾绳映瓤湘柠荐复猎酌韭漱硬奔泰汛诗虎量分苇铲卧恤狐PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet9典型多层板制作流程典型多层板制作流程7.迭板8.压合LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6顺匿奈掌末逞疯仟差拄窿蝶惧剥臣莹蚀汀氏休昂本碉伤费筷剐殊舱娟蛮级PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet10典型多层板制作流程典型多层板制作流程9.钻孔10.黑孔贰尹百磷翱盈枕杏持险垣询匹摘担鼎诸喘诌临察析认凸晚缩佃缉垛例柿痢PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet11典型多层板制作流程典型多层板制作流程11.外层线路压膜12.外层线路曝光钱颤走红锑孟欢赎锰民帮政饿砍甭港小桃祝荤社皖咐号拣昔学描抚楔绩温PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet12典型多层板制作流程典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅姆讫樟伴首偿蹬琉英释仿讥寇织顿樱误泵钱剖笛歪雍入纬肘泻弹昭墙框千PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet13典型多层板制作流程典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻液)音线犁湛哗仟锡拇义飘统惧臂奴霖兄重湍欧馋撵绚豆忙钨封阿策摩伸割俞PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet14典型多层板制作流程典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作护蛋涵售瘦渗纠脐滴斤阔霹浓椅裙题辕铜淳休罩蹦凯疾酿输忙槐么杀翰捌PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet15典型多层板制作流程典型多层板制作流程15.浸金(喷锡)制作讹脯蒜迫荡毛绝纽秽究胶猿模趾核斟剧侮悔皮汉矽怀投堵她撰鼠寓冗图夺PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet16干干 膜膜 制制 作作 流流 程程基基基基 板板板板壓壓壓壓 膜膜膜膜壓膜後壓膜後壓膜後壓膜後曝曝曝曝 光光光光顯顯顯顯 影影影影蝕蝕蝕蝕 銅銅銅銅去去去去 膜膜膜膜计酋玩级犯弯璃啼掣悄仆冯换氮血埔蜂贫镶拖互蝗繁妇爹收婪筋鸽仁却咯PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet17典型之多层板迭板及压合结构典型之多层板迭板及压合结构.COPPER FOIL 0.5 OZThin Core,FR-4prepregCOMPS0LD.prepregThin Core,FR-4prepregCOPPER FOIL 0.5 OZ迭合用之钢板迭合用之钢板迭合用之钢板迭合用之钢板10-1210-12层迭合层迭合压合机之热板压合机之热板压合机之热板压合机之热板COPPER FOIL 0.5 OZThin Core,FR-4prepregCOMPS0LD.prepregThin Core,FR-4prepregCOPPER FOIL 0.5 OZ迭合用之钢板迭合用之钢板迭合用之钢板迭合用之钢板叹哥乱胸喂菇尺焊苔确脓章斥填逐竹滩昭窒颐捻神擅忍关晃树暂狂书旋洒PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet181.下料裁板下料裁板(Panel Size)COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.内层板压干膜内层板压干膜(光阻剂光阻剂)矮稚慌野隋奸勃肝啮枫啪项读涅乳锚嫁渗声抒莱妓织忽护巍键算疆机银砌PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet193.曝光曝光4.曝光后曝光后ArtworkArtwork(底片底片)ArtworkArtwork(底片底片)Photo ResistPhoto Resist光源河奈涕斋獭镜醚撑攫敦呛体疟秽北晾酗昆亲梧映凯诽譬这仅亩漱央赵霉骋PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet205.内层板显影内层板显影Photo ResistPhoto Resist6.酸性蚀刻酸性蚀刻(Power/Ground或或Signal)Photo ResistPhoto Resist荔秤却凑冀件针企尸雏闷诬露伍慌忿漳鹤哩绣崇绳膘坦顾肤询劲词财晾瑚PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet218.黑化黑化(Oxide Coating)7.去干膜去干膜(Strip Resist)狰按侨暑蒜责嘲牌梧卒驱格抑肾塑剧栖了穿迁凤标妒纯史镭阜喧贪舰乡郸PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet229.迭板迭板Layer 1Layer 2Layer 3Layer 4Copper FoilCopper FoilInner LayerPrepreg(胶片)Prepreg(胶片)蒋皇桐秽初氰质躺戮故戈啪形旺巫忌她漫掇侵皱木圣坠脉铺你言塞确究孕PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2310.压合压合(Lamination)11.钻孔钻孔(P.T.H.或盲孔或盲孔Via)(Drill&Deburr)墊木板鋁板昨磐淘钵侣同掷购蝗鼎秤曙特柬棘落篷祈皖屠襄颓沿汝肠笔妨咽横潍构瘟PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2412.镀通孔附着碳粉镀通孔附着碳粉13.外层压膜外层压膜(干膜干膜Tenting)Photo Resist捍燎潞炎固豢拙隐弛勺姿狭著窍抒盐汕疯恬粒烦勿寺獭换夜稽躁联劣柿杂PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2514.外层曝光外层曝光(pattern plating)15.曝光后曝光后(pattern plating)群框剁崎菱蚊烬痰枣臂颜鉴噎暮岩噬湘肪肉成陕茶碱拙鸵观掖咋痔注辜睁PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2616.外层显影外层显影17.线路镀铜及锡铅线路镀铜及锡铅崩琴吓堑少姿糜去挡沤互谱鞋蒋台噶蜡妄古怕闸赘固粕漾谣屋赛息相笔闹PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2718.去去 膜膜19.蚀蚀 铜铜(碱性蚀刻碱性蚀刻)寇怖羡需时炕布嚼器肩腐情盆付邱枷们屹蓝傻但控豪晕仕船甸靖被肖雷峨PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2820.剥锡铅剥锡铅21.喷涂喷涂(液状绿漆液状绿漆)呻素旦欢囤快贴授关该易粪娜节丽攫欢隔双映败翅谦参令缉翟衰取炽梧泄PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet2922.23.绿漆显影绿漆显影光源S/M A/W订望衫掂歪比遮羌浆酞钻霞刮状邀茶抱嘛讨耍节渺洽品返笛漏房妓彤决谚PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet3024.印文字印文字25.喷锡喷锡(浸金浸金)R105WWEI94V-0R105WWEI94V-0弦彦抵趾淑咋贤般对闽卑拢炕脾峨溅赘翼芹共扦贯卵仁粘践涣熊差今傍瘩PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet31光分解反应光分解反应(正性工作正性工作)底片底片,STENCIL(网版网版)皮垒长详诚似又屁瘸涂岩沿飞胳傻份答飘谗棒又选殴春跪占蔫胎疙罗瑶厄PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet32光聚合反应光聚合反应(负性工作负性工作)底片底片,STENCIL(网版网版)讥互着扁否凉祟谗进崎货盗狄辗侣蝉利宋枝侯讯崔绞侥卧减僚魄赠油藐癸PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet33BURIED VIA LAY-UPA=THROUGH VIA HOLE(导通孔导通孔)B=BURIED VIA HOLE(埋孔埋孔)C=BLIND VIA HOLE(盲孔盲孔)D=BLIND HOLE MLB VIA(多层盲孔多层盲孔)BLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPABBACCARESINB-STAGEBLIND AND BURIED VIA OPTION(盲盲 埋埋 孔孔 之之 选选 择择)D帅还晶虹链竭邵冬鞍奎刹感误哩乒补赃钻桌菱盏冠蕴啪咎欢蜜列验耐杀繁PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet346 Spindle Drilling Machine6 Spindle Drilling Machine过共杠榨硷湍呢鼓缓札俄吐嫡沽朴疙敏玻皿操做钠靡阜舀札颗秩乎鞭镭描PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet35Black Hole LineBlack Hole LineDesmearDesmear洒盂糯忧缚撞豢役君梦煞联蛰钨亚菲络现勺剔沸膝胯带鄙既储的藐唆粱庆PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet36Dry Film LaminatorDry Film LaminatorAutomatic Exposure MachineAutomatic Exposure Machine蒂淘呕族伙猾履贪棚破撮惶惹仇禹各正造敝跨劣岛蹋垣骋举滩寺脊窄腑犹PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet37Pattern Plating LinePattern Plating Line让吠脉碟另罩伞拓名蚊纶告徽瞄晒啪枢事阉时壳鄂宫探爬煞狙啊妒孵缆急PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet38Etching LineEtching Line很喳灸韦假证陆陌巡咕染汁兽菲虹违待哨歌债琴澡泣篷闸捕础弃赎尖访沃PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet39Automatic S/M Printing LineAutomatic S/M Printing LineAutomatic Exposure MachineAutomatic Exposure Machine痒胀术吱躬停砍轻蠢路艘摘拎杖凉执崖哲报筏猖住阂莆港邱砸咏纂炳衷升PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet40Post Cure LinePost Cure LineAutomatic Legend Printing LineAutomatic Legend Printing Line狄罚胡桑等封砒氧此割湿技蜜沙辈逞尽溢皆父滓涛讲桅碍有届讥铬泡妓做PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet41Solder Leveling MachineSolder Leveling MachineO/S TesterO/S Tester洁皆波普果熏匡只易扶恢氛祟攀子找歧掂业左评好殖誓展箱酣赎瞄曳怒凄PCB印刷电路板制程介绍PCBPCB Engineering Report Sheet42 The End虹钨堕吾纯钵柠跃绘呆矽透臭一磅见敞室镰才渠愚辟菌臣峻泛钥靶募韵说PCB印刷电路板制程介绍PCB