LITEON-Lead-free-reliability-test-standard-For-VRM-Products.ppt

按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,P&C SBG,Peripherals SBU,LITEON Reliability Test Standard For VRM Lead Free Products,DQE:Daisy Xu,Date:2005-1-31,Number:DQE-LF-050131-001,Revision:A.0,WWW.LITEON.COM,Table of Contents,1.0 Revision History.,.,.,.,.4,2.0 Introduction.,.,.5,2.1 Purpose/Objective.,.,.5,2.2 Scope.,.,.,.,.5,2.3 Reference Documents,.,.,.6,2.4 Procedure.,.,.,.,.6,2.5 Reliability test follow chart.7,3.0 Reliability Test Plan.,.,.,.,.8,3.1 Pre-Test.,.,.,.,.10,3.1.1 Visual Inspection .10,3.1.2 Cross-Section Analysis.10,3.1.3 C-SAM and X-Ray Inspection.11,3.2 Tin Whisker Test.12,Table of Contents,3.2.1 Test Conditions.12,3.2.2 Mean Life Calculation Method.13,3.2.3 PASS/FAIL Criteria.14,3.3 Thermal cycle for solder joint reliability test.15,3.4 HALT Test.16,3.5 Vibration Test.17,3.6 Mechanical Shock Test.18,3.7 Drop Test.19,3.8 Accelerated Life Test(DMTBF Test).20,3.8.1 Initial Function test.20,3.8.2 Test condition.21,3.8.3 PASS/FAIL Criteria.23,4.0 Appendix:Sample Requirement&Distribution .24,5.0 References.25,1.0 Revision History,Revision,Description,Reviser,Date,A.0,Initial Release,Daisy Xu,2005/1/31,2.0 Introduction,2.1 Purpose/Objective,The goal of this document is to clearly define the reliability test plan for VRM lead-free products in LITEON company,the objective is to verify whether the lead-free products can meet customers reliability requirement or not.,2.2 Scope,This procedure be used for LITEON company Lead-Free models,on-going reliability test will be according to document,QI-36 Rev A.0,The requirements listed in this document for VRM lead-free power supply which assemble in Lieton electronics(Dong Guan)CO.,LTD.,2.3 Reference Documents,Reliability Qualification Requirements for Lead-Free Products from related customers.,JESD22-A104-B“Temperature Cycling”,JESD22-B104-B“Mechanical Shock”,JESD22-B103-B“Vibration,Variable Frequency”,IPC-A-610C,“Acceptability of Electronic Assemblies”,Liteon HALT test and environment reliability test standard,Accelerated Life Test refers to document MIL-STD-217.,2.4 Procedure,Prior to the start of reliability testing,process optimization studies for,Pb,-free should be performed through DOE selecting the best solder paste for screen printing and solder joint integrate.the functional test and visual inspection are necessary.,2.5 Follow Chart For Lead-Free Reliability Test,Wave,soldering,Visual,Inspection,Manual,soldering,Visual,Inspection,Finish,Goods,Tin Whisker test,Conclusion,&Summary,Report,NG,NG,Final Test,Manufacturing Process,Reliability Testing Flow,Reliability test,Vibration test,Shock test,HALT,Thermal cycle/shock,Demonstration MTBF,Drop test for container,Judge,OK,Rework,NG,Pre-Test,1.X-Ray and C-SAM,inspection(CSP,BGA),2.Cross-Section,3.Visual inspection,4.Function Test,1.X-Ray and C-SAM,Inspection(CSP BGA),2.Cross-Section,3.Visual inspection,4.Function Test,Function Test,OK,OK,3.0 Reliability Test Plan,This reliability test document consists of several test items,detailed test conditions,sample size and pass/fail criteria please refer below test procedure,Before the reliability test,below action will be performing(the criteria of all below inspection will be followed the standard IPC-A-610C and customers requirement).,1.Continuity or Functionally test PCBAs.,2.Visually inspection for all test samples(Solder side and solder joint;).,3.C-SAM and X-Ray inspection selected components(for CSP and BGA using).,4.Cross-Section(for key component Transformer,Diode,Heat Sink,MOSFET,Inductor),After the reliability test,below action will be performing:(the criteria of all below inspection will be followed the standard IPC-A-610C and customers requirement).,1.Visual inspection for all test samples(Include solder joint and solder side).,2.Functional verification(or electrical continuity test),3.Cross-Section(for key component Transformer,Diode,Heat Sink,MOSFET,Inductor),4.C-SAM and X-ray inspection selected components(for CSP and BGA using).,5.Reliability Analysis(e.g.Weibull Plot ect).,6.Test report and failure analysis(if failure occurred),3.1 Pre-Test,Before the reliability test,below test will be performed,if all the test pass the inspection then to continue to testing,else go back and check failed root cause and rebuild samples.,3.1.1.Visual inspection,All tested samples will be inspected the solder joints by using a 10X magnifier,those questionable solder joint will be determined by a 40X Magnifier.,PASS/FAIL Criteria,:follows standard IPC-610C,any solder joint crack or fatigued will classified as Fail.,3.1.2.Cross-Section Analysis,Two units will be to do the Cross-Section analysis,each heavy metal(parts),location(include Transformer,inductor,heat sink,MosFet,Diode)will be selected to do Cross-Section.,PASS/FAIL Criteria,:,all criteria are follow SnPb standard,3.1.3.C-SAM and X-Ray Inspection,Perform C-SAM and X-ray on key IC package components including CSP and BGA after assembly and rework,Sample Size:5 units for each model.,PASS/FAIL Criteria:,1.Any joints with 20%voiding by area will be judged Fail.,2.Any solder joint crack will be judged Fail,3.Any Solder joint short will be judged Fail,3.2.1.Test Condition:,High temperature and high humidity Storage,60,95%R.H.,(NEMI recommend method),Non-operating,Storage time:1000 hours,Test Quantity:3,pcs,Equipment:KSON THS-B7H+-100,3.2.Tin Whisker Test,Due to the pure tin plating has a tendency to grow single crystal filaments,termed“whiskers,”which can short adjacent terminals.The storage humidity and thermal cycling test were developed as the accelerated tests to predict tin whiskers,Before the Tin Whisker test,the inspected components must be selected and create initial inspection data by 3D OM,this ensure we can know the grow speed of the tin whisker at different test condition.,For the Tin whisker test,below two tests will be performed.,Thermal Cycle test,Temperature:-5585,(NEMI recommend method),Non-operating,Dwell time 15min at each temperature,Cycle Times 1000cycles,Quantity 3 PCS,Equipment:KSON THS-B7H+-120,Remark:during the temperature and humidity test,the case must be removed.,3.2.2.Mean Life(MTBF)Calculation Method,Temperature&Humidity Effects Pecks model,AFtemp=(Ea/K)(1/Tu)-(1/Tt);AF,RH,=(RHt/RHu)3,Ea:Activation Energy(use 0.5ev),K:Boltzmanns Constant,AFTemp:Temperature Accelerative Factor,AF,RH,:Humidity Accelerative Factor,3.2.3.PASS/FAIL Criteria:,1.Maximum allowable tin whisker length is 50 micron,2.7 years life guarantee for the Tin whisker risk,please refer to the explanation.,Tt:Test environmental junction temperature(in K),Tu:Use environmental junction temperature(in K),RHt:Test environment relative humidity,RHu:Use environment relative humidity,Model of MTBF:Generalized Exponential Model(for Time-Terminated Test),MTBF=(N*T*AF)/TR,N:Sample size T:Testing time,AF:Accelerated Factor=AFtemp*AF,RH,TR:Test Ratio(refer to attachment),According to above explanation,we can estimate the mean life to guarantee for,no Tin Whisker.,3.3.Thermal Cycling Test,a).Test Condition,Temperature:-40125 (follow standard JEDEC 22-A104B condition G),Rate 15/min,Dwell time 30 min at each temperature,Cycle Times 1000cycles,b).Test Equipment:KSON THS-B7H+-120,c).Test Quantity:20PCS,d,)PASS/FAIL Criteria:,1).Zero solders joint failures accepted unless product life requirements allow for,a failure.,2)During the thermal cycle,the function will be tested every 500 cycles,3)After the thermal cycle test,the visual inspection will be performed,4)Failure criteria:functional failure or solder joint cracked50%through,3.4 HALT Test,a)Test condition:,Detail test plan please refer to attachment,b)Equipment:,HALT Tester:QualMark OVS2.5elf,c)Sample quantity:,4 units,d,)PASS/FAIL Criteria:,1).All test samples will be performed Visual inspection and function test,Zero solders joint failures accepted unless product life requirements,allow for a failure.,2)Any parameter,function lost due to solder joint problem will classified,as Fail.,3.5 Vibration Test,Test condition,Operation and non-operation,Random vibration:Vibration Level 6,Grms,or customers spec,Axis:X,Y,Z,Test duration:15min/axis,b)Equipment:,SHINKEN G-0180N,c)Sample quantity:,4 units,d,)PASS/FAIL Criteria:,1).All test samples will be performed Visual inspection and function test,Zero solders joint failures accepted unless product life requirements,allow for a failure.,2)Any parameter,function lost due to solder joint problem will classified,as Fail.,Test condition:,a,)1.Non-operating,2.Square wave shock:Begin at 40G(200in/sec),20G increments until 80G,3.Half-sine shock:Begin at 142G,2ms,60G increments until 322G,4.The unit will be tested on all flat sides,5.Sample quantity:4pcs,b)Equipment,:This test be done by external company,c)PASS/FAIL Criteria,:,1.After completion of the shock testing for the half sine waveforms,the drives must have no unrecoverable error,2.Drives must perform functionally as intended without loss of functionality i.e.,no missing,etc.,3.No evidence of physical damage or failure to pass electrical test.,3.6 Mechanical Shock Test,Test condition:,Follow customer package test spec first,but we will use the HP package spec if there is no special requirement asked by our customer,PASS/FAIL Criteria:,a,.All,test samples will be performed Visual inspection and function test,Zero solders joint failures accepted unless product life requirements,allow for a failure.,b.Any,parameter,function lost due to solder joint problem will classified,as Fail.,3.7.Drop Test For Container,3.8 MTBF Test,In order to evaluate the reliability of lead free product more quickly than normal use condition,the DMTBF test should be implemented.The typical sample size is 30 units.,3.8.1.Initial Function test,The function test condition should be implemented based on the yellow book of power supply.The Hi-pot,ATE test and structure inspection are included,3.8.2.Test condition,Based on,Arrhenius,Accelerate Life Test model,the DMTBF test increased the ambient temperature to max operation temperature and combined power on/off cycles as the accelerate factors.,DMTBF test duration can be calculated as following equations,AF temp=exp(Ea/K)(1/Tspec -1/Telev),AF temp,-Acceleration Factor due to elevated temperature,AF power,-Acceleration factor due to power cycling,Ea,-Activation energy this is an average of the sum of the,activation energy for each component divide by the number,of components.The units are,eV,K,-Boltzmans constant=8.618 x 10-5,eV,/K,T,elev,-Elevated temperature in K.(0K=273+elevated,temperature in C),T spec-,-Specified temperature in 0K(0K=273+specified,temperature in C),Duration(,hrs)=(MTBF spec x GEM Factor CL)/(DC x Sample size x,AF temp x AF power),MTBF spec-,-Customer Specified MTBF value in Specification,GEM Factor CL,-The factor from the GEM(General Exponential Model for Time Terminated Tests)for the given CL and chosen allowed failures.,DC,-Duty Cycle for assumed power cycling.,Sample Size,-Number of samples tested.,AF temp-,-Calculated acceleration factor for elevated temperature.,3.8.3.PASS/FAIL Criteria:,All the Electronic function safety test are pass and meet customer specification.,Note:The reliability test plan will be revised according to relevant international standards collected.,4.0 Appendix:Sample Requirement&Distribution,No.,Test Item,Sample Size,Memo,1,Pre-test,Visual inspection,All Samples,Cross Section Analysis,2,X-Ray and C-SAM inspection,5,2,Tin Whisker,High temperature and high humidity,3,Thermal Cycle test,3,3,Thermal cycle test,20,4,HALT Test,4,5,Vibration Test,4,6,Mechanical Shock Test,4,7,Drop Test,For container,8,DMTBF Test,30,1.J-STD-020B“Moisture/Reflow Sensitivity Classification for NonHermitic Solid State Surface Mount Devices”,July 2002(020C to be released soon).,2.J-STD-003A,“Solderability Tests for printed Circuit boards”,February 2003,3.IPC-A-610C,“Acceptability of Electronic Assemblies”,January 2000,4.Liteon internal HALT standard,5.IPC-SM-785“Guidelines for Accelerated reliability Testing.”,November 1992.,6.MIL-STD-202G,Method 208H,“Solderability”,February 2002.,7.JESD22-A104-B“Temperature Cycling”,July,2000.,8.JESD22-B103-B“Vibration,Variable Frequency”,June,2002.,9.JESD22-B104-B“Mechanical Shock”,March,2001.,5.0 References,Thanks,for Your Continuous Supports!,