半导体量测设备和应用介绍专业知识讲座.ppt

单击以编辑母片标题样式,单击以编辑母片文字样式,第二层,第三层,第四层,第五层,*,*,本文档所提供的信息仅供参考之用，不能作为科学依据，请勿模仿。文档如有不当之处，请联系本人或网站删除。,芯片凸块制程检验,雷,射扫瞄仍是目前凸块检测最广为使用的三维量测技术,Failure Analysis_1,Failure Analysis_2,Examples of solder bump defect,Explain,高阶封装技术,300mm,晶圆,高阶封装技术,Wafer Bump,3D Bump Inspection using Laser Triangulation,3D and 2D bump inspection is a critical component in manufacturing of bumped wafers.Continuous miniaturization and use of through silicon via(TSV)in 3D packages are pushing bump sizes smaller and smaller.The small bump size,small pitch and high number of bumps are challenging inspection technologies,requiring high accuracies and high throughput.,Laser triangulation,is the dominant technology for 3D characterization of solder and pillar bumps used in conventional packaging techniques.,The technology is a line scan laser with the ability to collect hundreds of 3D data points along one scan line in a fraction of a second.,These data points can then be used to build a 3D model of the top of the bump and surface of the wafer for local height inspection.As bump size and pitch continue to decrease and bump numbers head towards tens of millions per wafer,the speed and accuracy of laser triangulation technology gives 3DIC manufacturers the ability to tightly control bump processes and detect bump defects.,Basic Geometry of Laser Triangulation,雷射三角几何示意图,此雷射三维系统之量测精度，主要受限于,传感器之分辨率,及,投射之雷射光线宽,，越细的雷射线宽及高分辨率传感器，可获得较高之量测精度。,雷射三角,法系统架构图,利用程控，可以调整雷射光之线宽及扫瞄速度。,此系统之组成简单稳健，适合工业环境之实际应用。,Slit Scanner,Slit scanners are a direction extension of the basic triangulation,principle,非接触三角法探头原理,Wafer Scanner,For both standard and flip chip wafers,the Wafer Scanner,Inspection Series provides superior yield management for 3D/2D bump and RDL metrology,bump and RDL defect and macro defect inspection throughout post-fab processes.,Defects created in the post-fab area between wafer processing,bump processing and final manufacturing can negatively impact product yields and time-to-market.,The Wafer Scanner quickly and reliably locates bump and wafer defects,reducing process costs and improving yield.,Through-Silicon Via(TSV),A through-silicon via,3D package(3D IC)contains two or more chips stacked vertically,with vias through the silicon substrates replacing edge wiring to create an electrical connection between the circuit elements on each chip.,TSV technology provides a dramatic increase in the functionality of the device in a very small footprint.Multiple technologies are being explored to form vias during the wafer fabrication process(front-end)and the IC packaging and assembly stage(back-end).,Metrology and inspection of the TSVs are critical for ensuring the performance of the 3D ICs and the profitability of the overall manufacturing process.,Bump Inspection SystemSP-500B,The SP-500B automatically measures the heights,coplanarity,shapes and positions of the bumps on wafers or IC chips.,Toray,s Automatic Bump Inspection System Series,The 3D profiling technique is based on a newly developed optical interferometry,which has the world fastest measurement speed with sub-micron accuracy of height measurement.,Specifications,Test Results,August Technology,Designed for high-speed bump and wafer inspection,the system incorporates the Companys patent-pending three-dimensional(3D)Rapid Confocal Sensor,with proprietary two-dimensional(2D)bump and active die inspection technologies to provide bump manufacturers with high-speed and high accuracy combined in a single bump inspection solution.,812 Wafer,高阶,Solder Bump,检查机,高,Repepeatability(3):1 um,以下,业界的最快检查能力,对应,812 Wafer FOUP,自动机器,提供多种多样化的讯息报告,WVI-6000,Falcon 800,Camtek,开发的,Falcon 800,系列先进的测量系统用于凸起封装晶圆，并保证凸点达到他们严格的公差。,CTS,，,Camtek,三角测量系统（专利申请中）应用了比已知的三角测量原理更新的方式，提高了一系列凸起技术的精度与可重复性。更宽的角度范围创造了更多种类凸起形状与材料更强和更稳定的反射，支持凸起的真,3D,几何重建。,Falcon 800,更是特别设计用于最精细的金板的测量。,ASE,IS-100 is high-speed inspection developed for area array bump inspection,Measuring Method:,Triangulation by laser scanning.,Inspection object:,Solder bump on the wafer.,Handling:,Cassette to cassette inspection.,Result output:,Realtime display per chip and also can be recorder on MO.,Features,High speed measurement of the height for solder bumps with high accuracy(0.25m ave).Measuring range from 10 130m height.,High-speed inspection by AOD(Acousto Optical Deflector),laser scanning,and triangulation.Input and processing height and brughtness informations at 7 megapoint/sec.,Realtine display for inspection results per chip.,Wafer Bump 3D Inspection System,Wafer Bump 3D Inspection System Vi-Z800【Wafer Auto Handler】,Wafer Bump 3D Measurement,Wafer Bump 3D Measurement,Wafer Gold Bump Measurement Inspection/MEM-5296D,2D、3D、SD for Bumping检测设备,主要用途,具有高速及高精度测试,Wafer Bump,的功能测试分辨力为,0.1,m,世界领先地位的生产能力,产品应用,缺陷检测功能高精度,Bump Height,检测能力及再生产的功能,产品特色,1.,高速的检测能力,2.,提供有效的,Off-Line Review,功能,3.,对客户端提供简易的操作使用系统,4.,用独有的高精度激光变位传感器来实现高精度 的测试 采用微细激光线的排列 用,PSD,排列来达到高速测试 对高度和缺陷进行高精度的检测，实现了先进 的运算法则。,5.,先进的信号处理系统 采用高速的,A/D,转换机板 运用,DMA,技术来实现先进的高速信号处理 测试画面清晰,Buffalo 2D&3D,量测设备,机台特性,:,该机以花岗石主体结构设计，其材质对温度变化的膨胀系数小，以至于提升机台精度，再加上机台,X/Y,轴使用线性马达及线性滑轨设计，无背隙产生，提高机台精度与稳定性。提供量测软件操作简易，易学易懂，快速上线使用。,机型规格,:,标准机型,:,Buffalo 4(,总行程,400mmx400mm)Buffalo 6(,总行程,600mmx600mm)Buffalo 8(,总行程,800mmx800mm),另可依客户需求设计制作不同台面尺寸之规格 应用领域,:,PCB Panel Size,全范围应用,BGA,、,CSP Unit,、,Strip,Panel size 2D,3D,应用 光罩尺寸与线宽线距量测 覆晶载板锡球、盲孔量测 晶圆凸块,2D,3D,应用,TFT LCD 2D,3D,应用,Classic 2D&3D,量测设备,机台特性,:,该机以花岗石主体结构设计，其材质对温度变化的膨胀系数小，再加上机台,X/Y,轴使用线性马达及空气轴承设计，流畅的平台移动，更提高机台精度与稳定性。提供量测软件操作简易，易学易懂，快速上线使用。,机型规格,:,标准机型,:,Classic 600 HA(,总行程,600mmx600mm),另可依客户需求设计制作不同台面尺寸之规格应用领域,:,PCB Panel Size,全范围应用,BGA,、,CSP Unit,、,Strip,Panel size 2D,3D,应用 光罩尺寸与线宽线距量测覆晶载板锡球、盲孔量测 晶圆锡球,2D,3D,应用,TFT LCD 2D,3D,应用,VMMS,全自动锡球检测设备,机台特性,:,该机以花岗石主体结构设计，高精度与稳定性，搭配多站转盘式光学检测功能，,PLC,可程控运作，高数量与快速进出料，高精度,Multi sensor,精准地快速量测，算法与软件设计完全自主，零缺点,Sorting,自动检料功能，已达全自动在线设备。,量测项目：,锡球高度 共平面度,SMT,高度,Warpage of Substrate,锡球直径,锡球位置度,缺球,Bump Bridge,锡球体积,Ball Pad,高度,孔深,应用领域,:,覆晶载板检测,(,切割与未切割,),铜面盲孔与线路 穿孔量测 晶圆锡球检测 微小结构量测,D-Tek WBI-W300,Features,检测晶圆尺寸,:6”12”.,检查项目,:,a.,短路,Bridged.b.,缺球,Missing.c.,偏移,pitch&position.d.,多球,extra.e.,尺寸,diameter.f.,外观,shape.,图形化操作接口,:,a.,简易达成量产需求,.,b.,智能性设定及管理生产参数,.,SMEMA,相容,.,针对不良,WAFER,分类,.,Spec Ball Diameter:0.1.0.3mm,Ball Pitch:0.41.1mm Die size:0.5 x 0.5mm,Die pitch:Die size+1.5 x Ball Diameter,Ball Group Types:Grid,Checker,and Random Wafer thickness:0.25 1 mm.,Wafer Size:6”-12.,Voltage:1-phase,220 volts.,Frequency:60 hz.,WBI-W300,为全自动机械检测设备，其中包括机械手臂、晶圆定位、晶圆传送、,2,个,FOUPS,及强大的晶圆检测系统,.,针对植球及回焊所产生的缺点，,WBI-W300,能提供最快速，正确及高重复精度检测,如 此,100%,检测，能改善以往人工目检的缺失，并能对整条生产线质量管理严格把关,.,鸿骐科技,