计算机组织结构chap2.pptx

Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,William Stallings Computer Organization and Architecture,Chapter 2Computer Evolution and Performance,Generations of Computer,Vacuum tube-1946-1957,1,Transistor-1958-1964,2,Small,medium scale integration,1965-1971,3 IC,100-3,000 devices on a chip,Large scale integration-1972-1977,4,LSI,3,000-100,000 devices on a chip,Very large scale integration-1978-1991,5 VLSI,100,000-100,000,000 devices on a chip,Ultra large scale integration 1991-,6 ULSI,Over 100,000,000 devices on a chip,P24,When microcomputer?,1,st,computer,generation I,University of Pennsylvania,18,000,vacuum tubes,Decimal(not binary),Finished,1946,von Neumann/Turing,?,Main memory,storing programs and data,1,st,CPU interpreting instructions from memory and executing.,i.e.,fetch,instruction from memory,execute,instruction in CPU,binary,system,Structure of von Neumann machine,IBM,1953-the,701,IBMs first stored program computer,Scientific calculations,1955-the 702,Business applications,700 series,NJU,103,from Soviet Union,vacuum tubes,30,per second,memory,4096,32 bits/word,1959,first running computer in universities,one room in North building,Transistors,generation II,1958,Discrete,components,transistor,resistor,capacitor,on circuit boards,IBM 7000,DEC,Produced,PDP,-1,I,ntegrated,C,ircuit,generation III,1965,IC(Microelectronics),transistor,resistor,capacitor,on a chip,silicon wafer(,硅晶片,),Two fundamental types of components(P24),Gate for processing,Memory cell for storage,(,P141,),read,1,Carry signal,input,1,Logic,function,0,1,P28,1,input,write,Storage,cell,Logic,function,S,i,C,i,A,i,B,i,Moores Law,Increased density of components on chip,Number of transistors on a chip will,double every year,Since 1970s development has slowed a little,Number of transistors doubles,every 18 months,Higher packing density,shorter,electrical paths,Smaller,size,flexibility,Cost of chip,unchanged,Gordon Moore-cofounder of Intel,P29,IBM 360 series,Multiplexed,switch structure(Fig.2.5,P23),DEC PDP-8,First,mini,computer,BUS,structure,F,A,.,.,B,C,D,S,1,S,2,.,.,.,.,.,.,Multiplexer connects multiple inputs to a single output.At any,time,one of the inputs is selected to be passed to the output.,MUX,memory,I/O 1,I/O 2,I/O 3,CPU,DEC-PDP-8 Bus Structure,OMNIBUS,Console,Controller,CPU,Main Memory,I/O,Module,I/O,Module,P31,Series 200 in China,210 360/30 南大，常州无线电厂,220 360/40,240 360/50 北大，北京738厂,260,LSI,generation IV,1971-400,4,First,microprocessor,All CPU components on a single chip,4,bit,1974,-,8080,Intels first,general purpose,microprocessor,8,bit,PCA,8086,16,bit processor,486,32,bit,processor,Pentium,4,64,bit,processor,何谓,32,位处理机,?,Key distinguishing feature of a processor is the,number of bits,that the,processor deals with at a time.,32 bits+32 bits,Semiconductor Memory,1970,Magnetic core,storage,semiconductor memory,Much faster than core,Capacity approximately,doubles each year,Improve performance,CPU-,如何提高速度,?,-,提高集成度,=shorten the distance,between components,-increase frequency,-,pipelining,superscalar parallelism,-multicore.,Memory-,如何更大,?,如何提高存取速度,?,-,increase density of chip,-speed up run frequency(DDR3-1333)=,P37,Improve performance,I/O-,如何提高速度,?,-Device itself,(display,printer),-Caching,(disk cache),-Buffering,(printer,I/O module)for parallism,-New interface techniques:USB,use network technology,-.,Typical I/O Device Data Rates,Improve performance,interconnection-,如何提高速度,?,-,增加传输线的宽度,:16,位,32,64,-Higher-speed interconnection buses,-More elaborate bus structures:,hierarchy,-P73,-.,Problems,CPUdensity,frequency cause:?,-,RC delay,:as components on the chip decrease in size,wire interconnects become thinner,increase,r,esistance,.,wires are closer together,increasing,c,apacitance,-,Power,:p,ower density increases with density of,logic and clock speed,.,d,issipating heat is issue,Problems,Memorydensity cause:?,-reduce parallelism:as the density of chip increase,fewer memory chips are used.,Performance Mismatch,-Memory speed lags behind processor speed,Logic and Memory Performance Gap,Solutions,CPU-more emphasis on organizational and architectural approaches.,-,Multiple cores,:placing multiple processors on,single,chip.U,se two simpler processors on the chip rather than one more complex processor,Memory,-,make memory chip wider:increase number of bits retrieved at one time(pin),POWER4 Chip Organization,Solutions,Performance Mismatch,-incorporate caches,:L1 cache(,dedicating part of processor chip),L2 cache,Key is balance,Processor components,Main memory,I/O devices,Interconnection structures,Intel Microprocessor Performance,Examples of computer design,Pentium-CISCP41,PowerPC-RISCP42,Internet Resources,Summary,1.,History,ENIAC,1946,University of Pennsylvania,von Neumann machine-stored program,IBM 360 series mainframe,DEC PDP 11 minicomputer,Intel microprocessor,2.,Generations of Computer,vacuum tube,transistor,integrated circuit,LSI,VLSI,ULSI,3.,Three principal constituents of a computer system at IC level,4.Moores Law,Doubling performance every year(18 months),5.What is the,key distinguishing feature of,a microprocessor?,6.Improve performance,methods,problems,solutions,Assignment,网络查询,DDR3,SDRAM,chipset,Write a program to convert decimal numbers(appear in programs in HLL)to binary numbers,Chipset,Most CPUs today use a chipset of one or more chips that help bridge or connect the various buses to the CPU,Disk cache,When disk caching is being used,during any disk access the computer system also fetches program or data contents located in neighboring disk areas(such as the entire track)and transports them to a dedicated part of RAM known as a,disk cache,9,、静夜四无邻，荒居旧业贫。,11月-25,11月-25,Monday,November 10,2025,10,、雨中黄叶树，灯下白头人。,04:25:46,04:25:46,04:25,11/10/2025 4:25:46 AM,11,、以我独沈久，愧君相见频。,11月-25,04:25:46,04:25,Nov-25,10-Nov-25,12,、故人江海别，几度隔山川。,04:25:46,04:25:46,04:25,Monday,November 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